Micron Technology, Inc. in Singapore seeks an experienced packaging engineer to own architecture from feasibility through tape-out, qualification, and production readiness. You will act as the technical authority across product, silicon, technology, assembly, quality, supplier, and OSAT teams, balancing performance, manufacturability, cost, and schedule. A Master’s degree and 10 years’ experience are required, with Cadence Allegro / SiP tools and AI-enabled workflows. J-18808-Ljbffr
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$2k – $4k
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