HBM Packaging Product Engineer: Yield & AI/ML (Singapore)

Micron Technology, a leader in memory and storage solutions, invites experienced engineers to join the HIG HBM Package Product Engineering team in Singapore. You will drive yield improvements, test optimization, and cross-functional collaboration to enhance quality and cost metrics while advancing AI/ML initiatives. This role requires strong problem-solving skills, data analysis proficiency, and a track record in semiconductor packaging. J-18808-Ljbffr